IC Tray JEDEC Standard Anti-Static Chip Packaging Test Tray
Overzicht:
IC tray, also known as electronic chip tray, is a plastic tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing, complies with JEDEC international standards.
Product Introduction
IC tray, also known as electronic chip tray, is a plastic tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing, complies with JEDEC international standards.
It can prevent the product from electrostatic contact, protect the chip from damage, and facilitate automated detection and installation. IC trays can be used for various packaging methods such as BGA, QFN, QFP, PGA, TSOP, TQFP, LQFP, PLCC, SOC, SiP, etc.
IC tray material performance requirements
(1) In order to provide electrostatic protection for the chip, the material needs to have antistatic properties, and is generally modified by adding antistatic agents, conductive carbon black or conductive carbon fibers.
(2) Before the chip is assembled at the terminal, it must be baked to avoid moisture inside the chip, which requires the material to be heat-resistant.
(3) The gap between the upper and lower trays needs to hold the pins of the main chip to prevent the pins from shaking and bending or breaking. This requires certain dimensional stability of the material. (4) To avoid the impact of a humid environment on the chip, the tray material is required to have a low water absorption rate.
(5) In order to reduce pollution and save losses, materials are required to be reusable and recyclable.
Technical Specification
| Product name | IC tray | ||||
| Product model | BGA6x8 | BGA8x8 | BGA11.5×13 | BGA13x13 | |
 |
 |
 |
 |
||
| Specification parameters | ●Model | EA70608-10 | NXBG08080.912296REV.A | EA7121321-10 | NHBG13131.70820 |
| ●Tray cavity design | BGA | BGA | BGA | BGA | |
| ●Specifications | 6*8 | 8*8 | 11.5*13*0.8 | 13*13 | |
| ●Matrix | 16*30=480 | 12*29=348 | 8*19=152 | 8*20=160 | |
| ●Temperature MAX (℃) | 150 | 150 | 150 | 150 | |
| ●Surface Resistance | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | |
| ●Weight (g) | 138.5 | 162.4 | 125 | 110 | |
| Product name | IC tray | ||
| Product model | QFN5x5 | QFN7x7 | |
 |
 |
||
| Specification parameters | ●Model | EAM050501-10 | EAM0707-10 |
| ●Tray cavity design | QFN | QFN | |
| ●Specifications | 5*5 | 7*7 | |
| ●Matrix | 14*35=490 | 10*26=260 | |
| ●Temperature MAX (℃) | 150 | 150 | |
| ●Surface Resistance | 10^5(Ω)~10^11(Ω) | 10^4(Ω)~10^11(Ω) | |
| ●Weight (g) | 183.9 | 148 | |
Wereldwijde ESD-productiecapaciteit
Wanneer u inkoopt bij Sanwei, werkt u direct samen met een toonaangevende OEM/ODM-fabrikant. Wij beheren een ultramoderne 70.000+ m² geïntegreerde productiefaciliteit in het Centrale Industriepark van Yueqing, Zhejiang, waarbij elk afzonderlijk proces wordt beheerd, van eigen materiaalformulering tot het uiteindelijke zeer nauwkeurige productvormproces.
Geïntegreerde schaal
70.000+ m² geavanceerde productiefaciliteit, uitgerust met zware precisie-spuitgietmachines om grote wholesalebestellingen te verwerken met stabiele levertijden.
Volledige ketenbeheersing
Volledige beheer in eigen huis, variërend van R&D van eigen antistatisch materiaal, structurele malengineering, geautomatiseerde productie tot snelle wereldwijde logistieke levering.
Grوندige inspectie
Strenge grondstofcontroles in combinatie met meerpuntsmetingen van de oppervlakteweerstand op de productielijn garanderen dat 100% voldoet aan de internationale ESD-richtlijnen.
Antistatisch Producten en Oplossingen
Het leveren van uitgebreide elektrostatische bescherming gedurende uw gehele productie- en operationele levenscyclus.
SMT-apparatuur
Antistatische verzamelbakken en rekken voor geautomatiseerde lijnen.
Opslag & Logistiek
Veilingkarren, legborden, bakken, schalen en onderdelenbakken.
Werkplek & PBM
Antistatische stoelen, matten, polsbandjes en persoonlijke bescherming.
Maatwerkontwikkeling
Ontwikkeling van aangepaste matrijzen en speciale antistatische materialen.
ONZE OEM/ODM-VOORDELEN
Geavanceerde R&D & Materiaalinnovatie
Interne ontwikkelde antistatische materialen met nationale uitvindingsoctrooien en hittebestendigheid tot 200℃. Wij vormen niet alleen — we formuleren compounds.
Volledige productiecapaciteit
30.000㎡ fabriek met complete spuitgiet-, granulatie- en ondersteunende verwerkingssystemen voor een stabiele en efficiënte levering.
Volledig op maat gemaakt proces
Materiaalweerstand, kleur, afmetingen, logo, verpakking en certificeringen — aanpasbaar om te voldoen aan IEC61340-5-1, ANSI/ESD S20.20 of militaire normen.
Gecertificeerde Kwaliteit & Wereldwijde Naleving
“Sanwei heeft met succes aangepaste, hittebestendige, schone trays in natuurlijke kleur ontwikkeld voor onze halfgeleidermontagelijn, ter vervanging van geïmporteerde producten, waarmee uitstekende ESD-veiligheid wordt gewaarborgd en aan de hoge reinheidseisen van de werkplaats wordt voldaan.”
BEVERTROUWD DOOR WERELDWIJDE FORTUNE 500 INDUSTRIELEADERS
Onze propriëtaire ESD-oplossingen worden wereldwijd ingezet in geavanceerde productiefaciliteiten, waaronder: Intel, Motorola, Siemens, IBM, Panasonic, Nokia en Dell.
Op zoek naar aangepaste maten of bulk groothandelsprijzen?
Ondersteund door ons robuuste eigen R&D-team biedt Sanwei complete OEM/ODM-opties die zijn afgestemd op uw specifieke SMT-productielijnen of magazijnindeling. Neem vandaag nog contact op met onze specialisten voor aangepaste matrijzen, kleurcodering of geïntegreerd 5S-opslagadvies.
Veelgestelde Vragen (FAQ)
1. What is an IC tray?
It’s basically a plastic tray that holds semiconductor chips during manufacturing, testing, shipping, and storage. They’re specially made to be ESD‑safe so static doesn’t fry the chips. Most of them follow standard sizes so they work with automated handling equipment.
2. What are the materials used in IC packaging?
That’s a whole “package” of stuff – you’ve got the molding compound (usually epoxy resin), a substrate (organic or ceramic), lead frames, die attach adhesives, bonding wires, and solder balls. All these materials work together to protect the chip, connect it to the circuit, and help keep it cool.
3. What material are ice trays made of?
Ice trays for your freezer are a totally different story – they’re all about food safety. The most common are food‑grade polypropylene (PP) and silicone. Silicone’s nice because it’s flexible and makes popping out the ice cubes super easy.
4. What is the standard tray size?
When people say “standard tray,” they usually mean the JEDEC size – that’s 12.7 x 5.35 inches, or about 322.6 x 136 mm. Thickness can be either 0.25 inches (thin) or 0.40 inches (thick). There’s also a common 320mm x 240mm size used internationally.
5. What is a JEDEC tray?
It’s a tray that meets the specs set by JEDEC – the group that writes standards for the semiconductor industry. Think of it as a universal container for chips (like BGA or QFP packages) so that trays from different manufacturers all fit the same machines and processes.
6. What is the tolerance of JEDEC trays?
They’re made to pretty tight tolerances to make sure chips sit exactly right. For example, the dimension accuracy is often around ±0.15 mm, and the overall flatness is kept within about 0.76 mm. That said, the exact numbers can vary a bit between suppliers – always check the data sheet.
7. What is the JEDEC standard?
JEDEC is basically the rule‑maker for the microelectronics world. They publish standards for everything from memory chips (like DDR5) to how parts are packaged and tested. It’s the common language that makes sure chips from different companies can work together.
8. What is the difference between JEDEC and IPC?
Think of it this way: JEDEC focuses on the chip itself – its electrical specs, physical dimensions, and testing. IPC, on the other hand, deals with the circuit board and assembly – how PCBs are designed, manufactured, and soldered. So JEDEC is about the silicon, IPC is about the board.
