• Tray IC
  • Tray IC
  • Tray IC
  • Tray IC
  • Tray IC
  • Tray IC
  • Tray IC
  • Tray IC
  • Tray IC
  • Tray IC
  • Tray IC
  • Tray IC
  • Tray IC
  • Tray IC

Tray IC

Aperçu

IC tray, also known as electronic chip tray, is a plastic tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing, complies with JEDEC international standards.

Présentation du produit

IC tray, also known as electronic chip tray, is a plastic tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing, complies with JEDEC international standards.

It can prevent the product from electrostatic contact, protect the chip from damage, and facilitate automated detection and installation. IC trays can be used for various packaging methods such as BGA, QFN, QFP, PGA, TSOP, TQFP, LQFP, PLCC, SOC, SiP, etc.

IC tray material performance requirements
(1) In order to provide electrostatic protection for the chip, the material needs to have antistatic properties, and is generally modified by adding antistatic agents, conductive carbon black or conductive carbon fibers.
(2) Before the chip is assembled at the terminal, it must be baked to avoid moisture inside the chip, which requires the material to be heat-resistant.
(3) The gap between the upper and lower trays needs to hold the pins of the main chip to prevent the pins from shaking and bending or breaking. This requires certain dimensional stability of the material. (4) To avoid the impact of a humid environment on the chip, the tray material is required to have a low water absorption rate.
(5) In order to reduce pollution and save losses, materials are required to be reusable and recyclable.

Spécification technique

Nom du produit Tray IC
Modèle de produit BGA6x8 BGA8x8 BGA11.5×13 BGA13x13
Tray IC Tray IC BGA11.5x13.jpg Tray IC
Paramètres de spécification ●Model EA70608-10 NXBG08080.912296REV.A EA7121321-10 NHBG13131.70820
●Tray cavity design BGA BGA BGA BGA
●Specifications 6*8 8*8 11.5*13*0.8 13*13
●Matrix 16*30=480 12*29=348 8*19=152 8*20=160
●Temperature MAX () 150 150 150 150
●Surface Resistance 10^5(Ω)~10^11(Ω) 10^5(Ω)~10^11(Ω) 10^5(Ω)~10^11(Ω) 10^5(Ω)~10^11(Ω)
●Weight (g) 138.5 162.4 125 110
Nom du produit Tray IC
Modèle de produit QFN5x5 QFN7x7
Tray IC Tray IC
Paramètres de spécification ●Model EAM050501-10 EAM0707-10
●Tray cavity design QFN QFN
●Specifications 5*5 7*7
●Matrix 14*35=490 10*26=260
●Temperature MAX () 150 150
●Surface Resistance 10^5(Ω)~10^11(Ω) 10^4(Ω)~10^11(Ω)
●Weight (g) 183.9 148
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