IC Tray JEDEC Standard Anti-Static Chip Packaging Test Tray
Ikhtisar:
IC tray, also known as electronic chip tray, is a plastic tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing, complies with JEDEC international standards.
Product Introduction
IC tray, also known as electronic chip tray, is a plastic tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing, complies with JEDEC international standards.
It can prevent the product from electrostatic contact, protect the chip from damage, and facilitate automated detection and installation. IC trays can be used for various packaging methods such as BGA, QFN, QFP, PGA, TSOP, TQFP, LQFP, PLCC, SOC, SiP, etc.
IC tray material performance requirements
(1) In order to provide electrostatic protection for the chip, the material needs to have antistatic properties, and is generally modified by adding antistatic agents, conductive carbon black or conductive carbon fibers.
(2) Before the chip is assembled at the terminal, it must be baked to avoid moisture inside the chip, which requires the material to be heat-resistant.
(3) The gap between the upper and lower trays needs to hold the pins of the main chip to prevent the pins from shaking and bending or breaking. This requires certain dimensional stability of the material. (4) To avoid the impact of a humid environment on the chip, the tray material is required to have a low water absorption rate.
(5) In order to reduce pollution and save losses, materials are required to be reusable and recyclable.
Technical Specification
| Product name | IC tray | ||||
| Product model | BGA6x8 | BGA8x8 | BGA11.5×13 | BGA13x13 | |
 |
 |
 |
 |
||
| Specification parameters | ●Model | EA70608-10 | NXBG08080.912296REV.A | EA7121321-10 | NHBG13131.70820 |
| ●Tray cavity design | BGA | BGA | BGA | BGA | |
| ●Specifications | 6*8 | 8*8 | 11.5*13*0.8 | 13*13 | |
| ●Matrix | 16*30=480 | 12*29=348 | 8*19=152 | 8*20=160 | |
| ●Temperature MAX (℃) | 150 | 150 | 150 | 150 | |
| ●Surface Resistance | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | |
| ●Weight (g) | 138.5 | 162.4 | 125 | 110 | |
| Product name | IC tray | ||
| Product model | QFN5x5 | QFN7x7 | |
 |
 |
||
| Specification parameters | ●Model | EAM050501-10 | EAM0707-10 |
| ●Tray cavity design | QFN | QFN | |
| ●Specifications | 5*5 | 7*7 | |
| ●Matrix | 14*35=490 | 10*26=260 | |
| ●Temperature MAX (℃) | 150 | 150 | |
| ●Surface Resistance | 10^5(Ω)~10^11(Ω) | 10^4(Ω)~10^11(Ω) | |
| ●Weight (g) | 183.9 | 148 | |
Kapasitas Manufaktur ESD Kelas Dunia
Saat Anda bermitra dengan Sanwei, Anda bekerja sama secara langsung dengan produsen OEM/ODM terkemuka di industri ini. Kami mengoperasikan fasilitas mutakhir Fasilitas produksi terintegrasi seluas 70.000+ m² di Taman Industri Pusat Yueqing, Zhejiang, mengelola setiap proses mulai dari formulasi bahan milik sendiri hingga pencetakan produk presisi tinggi akhir.
Skala Terintegrasi
Basis pabrik canggih seluas 70.000+ m² yang dilengkapi dengan mesin cetak suntik presisi tugas berat untuk menangani pesanan grosir massal dengan waktu tunggu yang stabil.
Kontrol Rantai Penuh
Pengendalian penuh di dalam perusahaan yang mencakup penelitian dan pengembangan material antistatis milik sendiri, rekayasa cetakan struktural, manufaktur otomatis, dan pengiriman logistik global yang cepat.
Inspeksi Ketat
Pengujian bahan baku yang ketat, dikombinasikan dengan pengukuran resistivitas permukaan multi-titik di jalur produksi, memastikan kepatuhan 100% terhadap pedoman standar ESD internasional.
Antistatis Produk dan Solusi
Menyediakan perlindungan elektrostatik yang komprehensif di seluruh siklus hidup manufaktur dan operasional Anda.
Peralatan SMT
Kotak dan rak pengumpul anti-statis untuk jalur otomatis.
Penyimpanan & Logistik
Kereta dorong pemindah barang, rak, kotak, nampan, dan wadah komponen.
Stasiun Kerja & APD
Kursi anti-statis, tikar, tali pergelangan tangan, dan perlindungan diri.
Pengembangan Kustom
Pengembangan cetakan khusus dan bahan anti-statis khusus.
KEUNGGULAN OEM/ODM KAMI
R&D Lanjutan & Inovasi Material
Material anti-statis yang dikembangkan secara internal dengan paten penemuan nasional dan ketahanan panas hingga 200℃. Kami tidak hanya mencetak — kami memformulasikan senyawa.
Kapasitas Produksi Skala Penuh
Pabrik seluas 30.000㎡ dengan sistem pengecoran injeksi, granulasi, dan pemrosesan pendukung yang lengkap untuk pasokan yang stabil dan efisien.
Kustomisasi Proses Penuh
Resistivitas material, warna, ukuran, logo, kemasan, dan sertifikasi — dapat disesuaikan untuk memenuhi standar IEC61340-5-1, ANSI/ESD S20.20, atau standar militer.
Kualitas Bersertifikat & Kepatuhan Global
“Sanwei berhasil mengembangkan baki warna alami bersih tahan suhu tinggi khusus untuk lini perakitan semikonduktor kami, menggantikan produk impor, memastikan keamanan ESD yang sangat baik, dan memenuhi persyaratan kebersihan yang tinggi di area kerja.”
DIPERCAYA OLEH PEMIMPIN INDUSTRI FORTUNE 500 GLOBAL
Solusi ESD hak milik kami diterapkan di fasilitas produksi elit di seluruh dunia, termasuk: Intel, Motorola, Siemens, IBM, Panasonic, Nokia, dan Dell.
Mencari Ukuran Kustom atau Harga Grosir dalam Jumlah Besar?
Didukung oleh tim R&D internal kami yang tangguh, Sanwei menyediakan opsi OEM/ODM lengkap yang disesuaikan dengan lini produksi SMT atau tata letak gudang spesifik Anda. Hubungi spesialis kami hari ini untuk cetakan kustom, kode warna, atau konsultasi penyimpanan 5S terintegrasi.
Pertanyaan yang Sering Diajukan (FAQ)
1. What is an IC tray?
It’s basically a plastic tray that holds semiconductor chips during manufacturing, testing, shipping, and storage. They’re specially made to be ESD‑safe so static doesn’t fry the chips. Most of them follow standard sizes so they work with automated handling equipment.
2. What are the materials used in IC packaging?
That’s a whole “package” of stuff – you’ve got the molding compound (usually epoxy resin), a substrate (organic or ceramic), lead frames, die attach adhesives, bonding wires, and solder balls. All these materials work together to protect the chip, connect it to the circuit, and help keep it cool.
3. What material are ice trays made of?
Ice trays for your freezer are a totally different story – they’re all about food safety. The most common are food‑grade polypropylene (PP) and silicone. Silicone’s nice because it’s flexible and makes popping out the ice cubes super easy.
4. What is the standard tray size?
When people say “standard tray,” they usually mean the JEDEC size – that’s 12.7 x 5.35 inches, or about 322.6 x 136 mm. Thickness can be either 0.25 inches (thin) or 0.40 inches (thick). There’s also a common 320mm x 240mm size used internationally.
5. What is a JEDEC tray?
It’s a tray that meets the specs set by JEDEC – the group that writes standards for the semiconductor industry. Think of it as a universal container for chips (like BGA or QFP packages) so that trays from different manufacturers all fit the same machines and processes.
6. What is the tolerance of JEDEC trays?
They’re made to pretty tight tolerances to make sure chips sit exactly right. For example, the dimension accuracy is often around ±0.15 mm, and the overall flatness is kept within about 0.76 mm. That said, the exact numbers can vary a bit between suppliers – always check the data sheet.
7. What is the JEDEC standard?
JEDEC is basically the rule‑maker for the microelectronics world. They publish standards for everything from memory chips (like DDR5) to how parts are packaged and tested. It’s the common language that makes sure chips from different companies can work together.
8. What is the difference between JEDEC and IPC?
Think of it this way: JEDEC focuses on the chip itself – its electrical specs, physical dimensions, and testing. IPC, on the other hand, deals with the circuit board and assembly – how PCBs are designed, manufactured, and soldered. So JEDEC is about the silicon, IPC is about the board.
