IC Tray JEDEC Standard Anti-Static Chip Packaging Test Tray
Resumen:
IC tray, also known as electronic chip tray, is a plastic tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing, complies with JEDEC international standards.
Product Introduction
IC tray, also known as electronic chip tray, is a plastic tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing, complies with JEDEC international standards.
It can prevent the product from electrostatic contact, protect the chip from damage, and facilitate automated detection and installation. IC trays can be used for various packaging methods such as BGA, QFN, QFP, PGA, TSOP, TQFP, LQFP, PLCC, SOC, SiP, etc.
IC tray material performance requirements
(1) In order to provide electrostatic protection for the chip, the material needs to have antistatic properties, and is generally modified by adding antistatic agents, conductive carbon black or conductive carbon fibers.
(2) Before the chip is assembled at the terminal, it must be baked to avoid moisture inside the chip, which requires the material to be heat-resistant.
(3) The gap between the upper and lower trays needs to hold the pins of the main chip to prevent the pins from shaking and bending or breaking. This requires certain dimensional stability of the material. (4) To avoid the impact of a humid environment on the chip, the tray material is required to have a low water absorption rate.
(5) In order to reduce pollution and save losses, materials are required to be reusable and recyclable.
Technical Specification
| Product name | IC tray | ||||
| Product model | BGA6x8 | BGA8x8 | BGA11.5×13 | BGA13x13 | |
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| Specification parameters | ●Model | EA70608-10 | NXBG08080.912296REV.A | EA7121321-10 | NHBG13131.70820 |
| ●Tray cavity design | BGA | BGA | BGA | BGA | |
| ●Specifications | 6*8 | 8*8 | 11.5*13*0.8 | 13*13 | |
| ●Matrix | 16*30=480 | 12*29=348 | 8*19=152 | 8*20=160 | |
| ●Temperature MAX (℃) | 150 | 150 | 150 | 150 | |
| ●Surface Resistance | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | |
| ●Weight (g) | 138.5 | 162.4 | 125 | 110 | |
| Product name | IC tray | ||
| Product model | QFN5x5 | QFN7x7 | |
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| Specification parameters | ●Model | EAM050501-10 | EAM0707-10 |
| ●Tray cavity design | QFN | QFN | |
| ●Specifications | 5*5 | 7*7 | |
| ●Matrix | 14*35=490 | 10*26=260 | |
| ●Temperature MAX (℃) | 150 | 150 | |
| ●Surface Resistance | 10^5(Ω)~10^11(Ω) | 10^4(Ω)~10^11(Ω) | |
| ●Weight (g) | 183.9 | 148 | |
Capacidad de fabricación ESD de clase mundial
Al abastecerse de Sanwei, se está asociando directamente con un fabricante OEM/ODM líder en la industria. Operamos unas instalaciones de vanguardia Instalación de producción integrada de más de 70 000 m² en el Parque Industrial Central de Yueqing, Zhejiang, gestionando cada proceso, desde la formulación de materiales patentados hasta el moldeado final de productos de alta precisión.
Balanza integrada
Base de producción avanzada de más de 70.000 m² equipada con máquinas de moldeo por inyección de precisión para trabajos pesados para gestionar pedidos al por mayor con plazos de entrega estables.
Control de cadena completa
Control interno completo que abarca la investigación y desarrollo de material antiestático propio, ingeniería de moldes estructurales, fabricación automatizada y entrega rápida de logística global.
Inspección rigurosa
Los rigurosos ensayos de las materias primas, combinados con mediciones multipunto de la resistividad superficial en la línea de producción, garantizan que el 100% cumpla con las directrices de las normas internacionales sobre ESD.
Antiestático Productos y Soluciones
Ofreciendo protección electrostática integral en todo su ciclo de vida operativo y de fabricación.
Equipos SMT
Cajas y soportes antiestáticos para líneas automatizadas.
Almacenamiento y Logística
Carros de rotación, estantes, cajas, bandejas y contenedores de componentes.
Estación de trabajo y EPP
Sillas antiestáticas, alfombrillas, pulseras antiestáticas y protección personal.
Desarrollo a medida
Desarrollo de moldes personalizados y materiales antiestáticos especiales.
NUESTRAS VENTAJAS OEM/ODM
I+D Avanzada e Innovación de Materiales
Materiales antiestáticos desarrollados internamente con patentes de invención nacionales y resistencia al calor de hasta 200 ℃. Nosotros no solo moldeamos, formulamos compuestos.
Capacidad de producción a escala completa
Planta de 30.000 m² con sistemas completos de moldeo por inyección, granulación y procesamiento auxiliar para un suministro estable y eficiente.
Personalización de proceso completo
Resistividad del material, color, tamaño, logotipo, embalaje y certificaciones — personalizables para cumplir con las normas IEC61340-5-1, ANSI/ESD S20.20 o estándares militares.
Calidad Certificada y Cumplimiento Global
“Sanwei desarrolló con éxito bandejas personalizadas de color natural limpio y resistentes a altas temperaturas para nuestra línea de ensamblaje de semiconductores, reemplazando productos importados, garantizando una excelente seguridad ESD y cumpliendo con los altos requisitos de limpieza del taller.”
CON LA CONFIANZA DE LOS LÍDERES INDUSTRIALES GLOBALES DE FORTUNE 500
Nuestras soluciones ESD patentadas se implementan en instalaciones de producción de élite en todo el mundo, incluidas: Intel, Motorola, Siemens, IBM, Panasonic, Nokia y Dell.
¿Busca tamaños personalizados o precios de venta al por mayor?
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Preguntas frecuentes (FAQ)
1. What is an IC tray?
It’s basically a plastic tray that holds semiconductor chips during manufacturing, testing, shipping, and storage. They’re specially made to be ESD‑safe so static doesn’t fry the chips. Most of them follow standard sizes so they work with automated handling equipment.
2. What are the materials used in IC packaging?
That’s a whole “package” of stuff – you’ve got the molding compound (usually epoxy resin), a substrate (organic or ceramic), lead frames, die attach adhesives, bonding wires, and solder balls. All these materials work together to protect the chip, connect it to the circuit, and help keep it cool.
3. What material are ice trays made of?
Ice trays for your freezer are a totally different story – they’re all about food safety. The most common are food‑grade polypropylene (PP) and silicone. Silicone’s nice because it’s flexible and makes popping out the ice cubes super easy.
4. What is the standard tray size?
When people say “standard tray,” they usually mean the JEDEC size – that’s 12.7 x 5.35 inches, or about 322.6 x 136 mm. Thickness can be either 0.25 inches (thin) or 0.40 inches (thick). There’s also a common 320mm x 240mm size used internationally.
5. What is a JEDEC tray?
It’s a tray that meets the specs set by JEDEC – the group that writes standards for the semiconductor industry. Think of it as a universal container for chips (like BGA or QFP packages) so that trays from different manufacturers all fit the same machines and processes.
6. What is the tolerance of JEDEC trays?
They’re made to pretty tight tolerances to make sure chips sit exactly right. For example, the dimension accuracy is often around ±0.15 mm, and the overall flatness is kept within about 0.76 mm. That said, the exact numbers can vary a bit between suppliers – always check the data sheet.
7. What is the JEDEC standard?
JEDEC is basically the rule‑maker for the microelectronics world. They publish standards for everything from memory chips (like DDR5) to how parts are packaged and tested. It’s the common language that makes sure chips from different companies can work together.
8. What is the difference between JEDEC and IPC?
Think of it this way: JEDEC focuses on the chip itself – its electrical specs, physical dimensions, and testing. IPC, on the other hand, deals with the circuit board and assembly – how PCBs are designed, manufactured, and soldered. So JEDEC is about the silicon, IPC is about the board.
