IC Tray JEDEC Standard Anti-Static Chip Packaging Test Tray
Aperçu
Le plateau CI, également connu sous le nom de plateau de puce électronique, est un plateau en plastique utilisé par les entreprises d'encapsulation et de test de semi-conducteurs pour l'encapsulation et le test de leurs puces (CI), conformément aux normes internationales JEDEC.
Présentation du produit
IC tray, also known as electronic chip tray, is a plastic tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing, complies with JEDEC international standards.
Il peut empêcher le produit de contact électrostatique, protéger la puce contre les dommages et faciliter la détection et l'installation automatisées. Les plateaux de CI peuvent être utilisés pour diverses méthodes d'emballage telles que BGA, QFN, QFP, PGA, TSOP, TQFP, LQFP, PLCC, SOC, SiP, etc.
Exigences de performance des matériaux pour le plateau IC
Afin d'assurer une protection électrostatique de la puce, le matériau doit posséder des propriétés antistatiques et est généralement modifié par l'ajout d'agents antistatiques, de noir de carbone conducteur ou de fibres de carbone conductrices.
Avant que la puce ne soit assemblée dans le terminal, elle doit être cuite pour éviter l'humidité à l'intérieur de la puce, ce qui nécessite que le matériau soit résistant à la chaleur.
(3) L'espace entre le plateau supérieur et inférieur doit pouvoir accueillir les broches de la puce principale afin d'empêcher les broches de bouger, de se plier ou de se casser. Cela nécessite une certaine stabilité dimensionnelle du matériau. (4) Afin d'éviter l'impact d'un environnement humide sur la puce, le matériau du plateau doit avoir un faible taux d'absorption d'eau.
(5) Afin de réduire la pollution et d'éviter les pertes, les matériaux doivent être réutilisables et recyclables.
Spécification technique
| Nom du produit | Tray IC | ||||
| Modèle de produit | BGA6x8 | BGA8x8 | BGA11.5×13 | BGA13x13 | |
 |
 |
 |
 |
||
| Paramètres de spécification | ●Modèle | EA70608-10 | NXBG08080.912296REV.A | EA7121321-10 | NHBG13131.70820 |
| ● Conception de la cavité du plateau | CMB | CMB | CMB | CMB | |
| ●Spécifications | 6*8 | 8*8 | 11.5*13*0.8 | 13*13 | |
| Matrice | 16*30=480 | 12*29=348 | 8*19=152 | 8*20=160 | |
| ●Température MAX (℃) | 150 | 150 | 150 | 150 | |
| Résistance de surface | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | 10^5(Ω)~10^11(Ω) | |
| ●Poids (g) | 138.5 | 162.4 | 125 | 110 | |
| Nom du produit | Tray IC | ||
| Modèle de produit | QFN5x5 | QFN7x7 | |
 |
 |
||
| Paramètres de spécification | ●Modèle | EAM050501-10 | EAM0707-10 |
| ● Conception de la cavité du plateau | QFN | QFN | |
| ●Spécifications | 5*5 | 7*7 | |
| Matrice | 14*35=490 | 10*26=260 | |
| ●Température MAX (℃) | 150 | 150 | |
| Résistance de surface | 10^5(Ω)~10^11(Ω) | 10^4(Ω)~10^11(Ω) | |
| ●Poids (g) | 183.9 | 148 | |
World-Class ESD Manufacturing Capacity
When you source from Sanwei, you are partnering directly with an industry-leading OEM/ODM manufacturer. We operate a state-of-the-art 70,000+ m² integrated production facility in Yueqing Central Industrial Park, Zhejiang, managing every single process from proprietary material formulation to final high-precision product molding.
Integrated Scale
70,000+ m² advanced plant base equipped with heavy-duty precision injection molding machines to handle bulk wholesale orders with stable lead times.
Full-Chain Control
Complete in-house control spanning proprietary anti-static material R&D, structural mold engineering, automated manufacturing, and swift global logistics delivery.
Rigorous Inspection
Strict raw material testing combined with multi-point surface resistivity metering on the production line ensures 100% compliance with international ESD standard guidelines.
Antistatique Produits et Solutions
Delivering comprehensive electrostatic protection across your entire manufacturing and operational lifecycle.
Matériel SMT
Boîtes et racks antistatiques pour lignes automatisées.
Stockage et Logistique
Chariots de manutention, étagères, boîtes, plateaux et conteneurs de composants.
Poste de travail & EPI
Chaises antistatiques, tapis, bracelets antistatiques et protection personnelle.
Développement personnalisé
Développement de moules sur mesure et matériaux antistatiques spéciaux.
NOS AVANTAGES OEM/ODM
R&D Avancé & Innovation en Matériaux
In-house developed anti-static materials with national invention patents and heat resistance up to 200℃. We do not just mold — we formulate compounds.
Capacité de production à grande échelle
30,000㎡ plant with complete injection molding, granulation and supporting processing systems for stable and efficient supply.
Personnalisation complète du processus
Material resistivity, color, size, logo, packaging and certifications — customizable to meet IEC61340-5-1, ANSI/ESD S20.20 or military standards.
Qualité Certifiée & Conformité Globale
“Sanwei successfully developed custom high-temperature resistant clean natural color trays for our semiconductor assembly line, replacing imported products, ensuring excellent ESD safety, and meeting the high cleanliness requirements of the workshop.”
TRUSTED BY GLOBAL FORTUNE 500 INDUSTRY LEADERS
Our proprietary ESD solutions are deployed in elite production facilities worldwide, including: Intel, Motorola, Siemens, IBM, Panasonic, Nokia, and Dell.
Looking for Custom Sizes or Bulk Wholesale Pricing?
Backed by our robust in-house R&D team, Sanwei provides complete OEM/ODM options tailored to your specific SMT production lines or warehouse layout. Contact our specialists today for custom molds, color coding, or integrated 5S storage consulting.
Frequently Asked Questions (FAQ)
1. What is an IC tray?
It’s basically a plastic tray that holds semiconductor chips during manufacturing, testing, shipping, and storage. They’re specially made to be ESD‑safe so static doesn’t fry the chips. Most of them follow standard sizes so they work with automated handling equipment.
2. What are the materials used in IC packaging?
That’s a whole “package” of stuff – you’ve got the molding compound (usually epoxy resin), a substrate (organic or ceramic), lead frames, die attach adhesives, bonding wires, and solder balls. All these materials work together to protect the chip, connect it to the circuit, and help keep it cool.
3. What material are ice trays made of?
Ice trays for your freezer are a totally different story – they’re all about food safety. The most common are food‑grade polypropylene (PP) and silicone. Silicone’s nice because it’s flexible and makes popping out the ice cubes super easy.
4. What is the standard tray size?
When people say “standard tray,” they usually mean the JEDEC size – that’s 12.7 x 5.35 inches, or about 322.6 x 136 mm. Thickness can be either 0.25 inches (thin) or 0.40 inches (thick). There’s also a common 320mm x 240mm size used internationally.
5. What is a JEDEC tray?
It’s a tray that meets the specs set by JEDEC – the group that writes standards for the semiconductor industry. Think of it as a universal container for chips (like BGA or QFP packages) so that trays from different manufacturers all fit the same machines and processes.
6. What is the tolerance of JEDEC trays?
They’re made to pretty tight tolerances to make sure chips sit exactly right. For example, the dimension accuracy is often around ±0.15 mm, and the overall flatness is kept within about 0.76 mm. That said, the exact numbers can vary a bit between suppliers – always check the data sheet.
7. What is the JEDEC standard?
JEDEC is basically the rule‑maker for the microelectronics world. They publish standards for everything from memory chips (like DDR5) to how parts are packaged and tested. It’s the common language that makes sure chips from different companies can work together.
8. What is the difference between JEDEC and IPC?
Think of it this way: JEDEC focuses on the chip itself – its electrical specs, physical dimensions, and testing. IPC, on the other hand, deals with the circuit board and assembly – how PCBs are designed, manufactured, and soldered. So JEDEC is about the silicon, IPC is about the board.
